[Program Concept]

This program is designed for students in semiconductor‑related fields at UPWARDS partner universities(*) in both U.S. and Japan. A distinctive feature of Tohoku University’s semiconductor research is the comprehensive coverage of technology value chain from device to package development, and even equipment and material development. In this program, participants will visit various research labs on campus, feeling Tohoku University’s 78-year history of semiconductor research, with the largest clean room area among Japanese academia (total of 8,500m2), while also learning about the latest research and witnessing a legend that continues to be updated.

*UPWARDS partner universities
U.S. : Boise State University, Purdue University, Rensselaer Polytechnic Institute, Rochester Institute of Technology, University of Washington, Virginia Tech
 JAPAN : Hiroshima University, Institute of Science Tokyo, Kyushu University, Nagoya University

[Program Period]

July 29 – August 7, 2026

[Location & Venue]

Tohoku University, Sendai, Japan

[Maximum Enrollment from Partner Universities]

20 students : 1~3 students per university, from both U.S. and Japan
Please note that if the total number of nominees from all partner universities exceeds 20, not all nominees may be accepted. We appreciate your understanding.

[Program Fee]

USD3,500 per student

Program Fee Includes:
-Tuition for the ten-day program
-Stay accommodations
-Group meals
-Industry tour and field trip
-Transportation for program activities in Sendai
-Insurance coverage during program activities

Please note:
Students should plan for costs related to meals outside of group activities and personal or miscellaneous spending. The program fee does not include the cost of airfare, additional health or travel insurance beyond the program’s activity coverage, or visitor visa fees.

[Requirements]

Students enrolled in undergraduate or graduate programs in semiconductor-related fields at UPWARDS partner universities in both U.S. and Japan

[Application Method]

Please apply through your home university. The required documents for the application are as follows. Please submit all documents through the application form at the link below.

Application form: https://forms.gle/9YAqX6Quns2igkLo9

a. Nomination List (one list per university)

b. Student Information Sheet & Pledge of Compliance

c. Photocopy of ID (Preferably a copy of your passport)
*If a current passport is not available at this time, submit a copy of a student ID, driver’s license or another form of identification that has a photo of the nominee on it.

d. Transcript

[Deadline]

February 28, 2026

[Program Overview]

Tue. July 28 : Arrival day
Wed. July 29 : Orientation, Campus tour and Welcome ceremony
Thu. July 30 : Open campus
Fri. July 31 : Training session 1
Sat. August 1 : Field trip
Sun. August 2 : Free day
Mon. August 3 : Training session 2
Tue. August 4 : Industry tour
Wed. August 5 : Training session 3 , Eve of Sendai Tanabata Festival (fireworks)
Thu. August 6 : Training session 4
Fri. August 7 : Wrap up and Closing ceremony
Sat. August 8 : Departure day
*Detailed information will be published later.

[Information about Accommodation]

Tohoku University will provide accommodation at a business hotel in Sendai City, covering the period from July 28 to August 8.

[Contact Information]

Tohoku University UPWARDS Students Exchange Office
Program Coordinator : Shunji Suzuki, Specially Appointed Professor (Management)
email : upwards-students@grp.tohoku.ac.jp